Power supply

ABSTRACT

A power supply includes a bottom case, a top cover, a circuit board and a heat-dissipating fan. In this case, the bottom case and the top cover are fitted together to delimit an accommodating space. The circuit board is mounted on the bottom case and located within the accommodating space. The circuit board is provided thereon with a plurality of electronic components and a plurality of heat-dissipating elements, each heat-dissipating element being provided correspondingly to one of the electronic components and allowed to conduct heat, respectively. Each of the heat-dissipating elements is provided with a mounting hole. The heat-dissipating fan includes a supporting frame, a driving module provided on the supporting frame, and a fan blade set covering the driving module and being driven by the driving module to rotate. Moreover, the heat-dissipating fan is not provided with a barrier wall around the fan blade set.

FIELD OF THE INVENTION

The present invention is related to a power supply, particularly to apower supply using a heat-dissipating fan without a barrier wall arounda fan blade set.

BACKGROUND OF THE INVENTION

At present, each of all power supplies used in personal computersincludes a fan for heat-dissipation. The general arrangement of the fanis disclosed in patents, such as US 20090290293, US 20100284149, US20080266793, U.S. Pat. No. 6,074,296 and so on.

It may be clearly understood that, from patents listed above, each ofall currently used fans is provided with an outer frame, via which thefan is mounted on a housing of the power supply. Additionally, aflow-guiding channel, provided for a fan blade set to be suspendedtherein, is further delimited by the outer frame, such thatheat-dissipating airflow generated by the fan is discharged through theflow-guiding channel.

In this manner, although heat-dissipating airflow generated by the fanis collected, the heat-dissipating airflow is allowed to only dissipateheat locally in disguise without providing heat-dissipation for eachelement within the power supply effectively. Thus, effect ofheat-dissipation is reduced.

SUMMARY OF THE INVENTION

It is the main object of the present invention to solve the problem ofreduced effect of heat-dissipation due to an outer frame generallyprovided for a fan used in a power supply.

For achieving the above object, the present invention provides a powersupply, including a bottom case, a top cover, a circuit board and aheat-dissipating fan. The bottom case and the top cover are fittedtogether to delimit an accommodating space. The circuit board is mountedon the bottom case and located within the accommodating space. Thecircuit board is provided thereon with a plurality of electroniccomponents and a plurality of heat-dissipating elements, each of theplurality of heat-dissipating element being provided correspondingly toone of the plurality of electronic components and allowed to conductheat, respectively. Each of the plurality of heat-dissipatings elementsis provided with a mounting hole. The heat-dissipating fan includes asupporting frame, a driving module provided on the supporting frame, anda fan blade set covering the driving module and being driven by thedriving module to rotate. The supporting frame is presented as a flatplate and provided with a plurality of connecting ribs, each of theplurality of connecting ribs being respectively connected to one of themounting holes. Moreover, the heat-dissipating fan is not provided witha barrier wall around the fan blade set.

In one embodiment, the mounting hole is replaced by a gap formed betweena plurality of fins on each of the plurality of heat-dissipatingelements.

In one embodiment, lines interconnecting positions where the mountingholes are located are formed as a polygon.

In one embodiment, the plurality of heat-dissipating elements are ofequal height, in such a way that top edges of the plurality ofheat-dissipating elements are located on overlapping parallel lines, andeach of the mounting holes is respectively located on the top edge ofeach of the plurality of heat-dissipating elements.

In one embodiment, the top cover is provided with at least one ventfacing the heat-dissipating fan.

Besides, the present invention also provides a power supply, the powersupply including a bottom case, a top cover, a circuit board and aheat-dissipating fan. The bottom case and the top cover are fittedtogether to delimit an accommodating space. The circuit board is mountedon the bottom case and located within the accommodating space. Theheat-dissipating fan includes a supporting frame, a driving moduleprovided on the supporting frame, and a fan blade set covering thedriving module and being driven by the driving module to rotate. Thesupporting frame is provided with a main body provided for the drivingmodule and the fan blade set to be installed, as well as a plurality ofsupporting posts connected to the main body and fixed on the circuitboard, respectively. The supporting frame is not provided with a barrierwall around the fan blade set.

In one embodiment, the top cover is provided with at least one ventfacing the heat-dissipating fan.

In one embodiment, each of the plurality of supporting posts and themain body are two members, which may be separated from each other.

In one embodiment, lines interconnecting positions where the pluralityof supporting posts are located on the circuit board are formed as apolygon.

In one embodiment, the supporting frame is provided with a plurality ofconnecting ribs, each of the plurality of connecting ribs beingrespectively provided between two adjacent of the plurality ofsupporting posts.

In comparison with the conventional art, the feature obtained by what isdisclosed above in the present invention is as follows: theheat-dissipating fan disclosed in the present invention being notprovided with a barrier wall around the fan blade set. In other words,the heat-dissipating fan of the present invention is not provided withan outer frame. Thus, the heat-dissipating airflow generated by theheat-dissipating fan is not restricted by the outer frame any more inthe present invention, while heat dissipation in relation to each of theplurality of electronic components or member within the accommodatingspace is allowed so as to further enhance effect of heat-dissipation incomparison with the conventional art. On the other hand, theheat-dissipating fan of the present invention is not provided with anouter frame so as to decrease the noise produced by the heat-dissipatingfan from working.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded diagram of a power supply of one embodiment of thepresent invention.

FIG. 2 is an exploded diagram of a partial structure of the power supplyof the embodiment of the present invention.

FIG. 3 is a structural cross-section view of the power supply of theembodiment of the present invention.

FIG. 4 is a structural cross-section view of a power supply of anotherembodiment of the present invention.

FIG. 5 is a top view of a partial structure of a power supply of oneembodiment of the present invention.

FIG. 6 is an exploded diagram of a partial structure of a power supplyof another embodiment of the present invention.

FIG. 7 is a structural cross-section view of the power supply of anotherembodiment of the present invention.

FIG. 8 is a top view of a partial structure of a power supply of anotherembodiment of the present invention.

FIG. 9 is an exploded diagram of a structure of a power supply ofanother embodiment of the present invention.

FIG. 10 is an exploded diagram of a top cover of another embodiment ofthe present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The detailed description and technical content related to the presentinvention is described in accompany with the drawings as follows.

Referring to FIG. 1, FIG. 2, FIG. 3, FIG. 4, FIG. 5, the presentinvention provides a power supply 10. The power supply 10 may beimplemented according to the ATX specification. The power supply 10includes a bottom case 11, a top cover 12, a circuit board 13 and aheat-dissipating fan 14. In this case, the bottom case 11 and the topcover 12 may be presented in the form of a mutually fitted structure. Inone embodiment, each of the bottom case 11 and the top cover 12 isformed as U-shaped structure, respectively, such that the bottom case 11and the top cover 12 are fitted together to delimit an accommodatingspace 15. Further, the top cover 12 may be provided with a vent 121.Next, in the present invention, the bottom case 11 and the top cover 12may be implemented with many components according to the design.Furthermore, the bottom case 11 may be further mounted at the sidesthereof with a power input port 111 and at least one power output port112. The power input port 111 and the power output port 112 are providedat different sides of the bottom case 11. The number of the power outputports 112 may be modified as required for implementation.

Next, the circuit board 13 is mounted on the bottom case 11 and locatedwithin the accommodating space 15. The circuit board 13 is laid thereonwith a plurality of electronic components 131 and a plurality ofheat-dissipating elements 132, each of the plurality of heat-dissipatingelements 132 being provided correspondingly to one of the plurality ofelectronic components 131, respectively. In this case, the plurality ofelectronic components 131 are combined as at least a power calibrationcircuit, an electric power conversion circuit and etc., after beingarranged. Further, each of plurality of the heat-dissipating elements132 is contacted with one of the plurality of electronic components 131,to which each of the plurality of heat-dissipating elements 132 isprovided correspondingly, so as to conduct heat. Each of the pluralityof heat-dissipating elements 132 is provided with a mounting hole 133.In one embodiment, the plurality of heat-dissipating elements 132 are ofequal height, in such a way that top edges 134 of the plurality ofheat-dissipating elements 132 are located on overlapping parallel lines60. Moreover, each of the mounting holes 133 is located on the top edge134 of each of the plurality of heat-dissipating elements 132,respectively. Furthermore, the mounting hole 133 referred to in thepresent invention may be replaced by a gap 136 formed between aplurality of fins 135 on the plurality of heat-dissipating elements 132,just as illustrated in FIG. 2.

Furthermore, the heat-dissipating fan 14 of this embodiment includes asupporting frame 141, a driving module 142 provided on the supportingframe 141, and a fan blade set 143 covering the driving module 142 andbeing driven by the driving module 142 to rotate. The heat-dissipatingfan 14 is further connected to a power feeder (not illustrated in thisfigure) on the circuit board 13 via a power line 144, so as to acquireelectric power required for rotation. Further, the driving module 142 isimplemented as an electric motor configuration. Additionally, thesupporting frame 141 of the present invention is presented as a flatplate and provided with a plurality of connecting ribs 145, each of theplurality of connecting ribs 145 being connected to one of the mountingholes 133, respectively. The pattern of each of the plurality ofconnecting ribs 145 may be modified in accordance with the position orpattern of each of the plurality of heat-dissipating elements 132 onwhich the mounting hole 133 is provided. Further, the heat-dissipatingfan 14 of the present invention is not provided with a barrier wall,which is provided around the fan blade set 143. In other words, theheat-dissipating fan 14 is not provided with a flow-limiting channel,which is delimited by an outer frame and in which the fan blade set 143is suspended. In this way, the heat-dissipating fan 14 is allowed forgenerating heat-dissipating airflow within the accommodating space 15more specifically when operated electrically, so as to enhance theheat-dissipation performance.

In one embodiment, referring to FIG. 5, for the enhancement of stabilityof the heat-dissipating fan 14 during rotation, the mounting holes 133may be mapped out, such that a polygon 61 is formed by linesinterconnecting positions where the mounting holes 133 are located. Inthis way, the heat-dissipating fan 14 may be supported more stably, soas to reduce the possibility of sway of the heat-dissipating fan 14during rotation. Nevertheless, the amount of the mounting hole 133 usedin the embodiment of the present invention may be, for example but notlimited to, three. Other appropriate amount of the mounting hole 133 isalso applicable in the present invention.

Referring to FIG. 6, FIG. 7 and FIG. 10, another embodiment is alsoproposed, besides the above power supply 10, in the present invention.Different numerals are used below, however, for distinguishing betweenthe two embodiments. In this embodiment, the power supply 20 includes abottom case 21, a top cover 22, a circuit board 23 and aheat-dissipating fan 24. In this case, the bottom case 21 and the topcover 22 are fitted together to delimit an accommodating space 25. Thetop cover 22 may be provided with at least one vent 221 facing theheat-dissipating fan 24. Further, the circuit board 23 is mounted on thebottom case 21 and located within the accommodating space 25. Thecircuit board 23 is laid with a plurality of electronic components 231and the plurality of heat-dissipating elements 232 as required forimplementation. The electronic components 231 are combined as a powercalibration circuit, an electric power conversion circuit and etc.,after being arranged. Moreover, the plurality of heat-dissipatingelements 232 may be laid as required for implementation.

Further, the heat-dissipating fan 24 includes a supporting frame 241, adriving module 242 provided on the supporting frame 241, and a fan bladeset 243 covering the driving module 242 and being driven by the drivingmodule 242 to rotate. In this embodiment, the supporting frame 241 isprovided with a main body 244 provided for the driving module 242 andthe fan blade set 243 to be installed, as well as a plurality ofsupporting posts 245 connected to the main body 244 and fixed on thecircuit board 23, respectively. More specifically, the main body 244 ispresented as a flat plate. The main body 244 is provided with at least aflat portion 246 provided for the driving module 242 to be placed, aswell as a protruding portion 247 connected to the flat portion 246 andlocated at the center of the main body 244 for the fan blade set 243 tobe fitted. In one embodiment, the main body 244 further includes aplurality of connecting portions 248 extending from the edge of the flatportion 246, respectively. Each of the connecting portions 248 iscorresponded to one of the plurality of supporting posts 245,respectively. Next, the circuit board 23 is provided with a plurality ofthrough-holes 233 provided for the plurality of supporting posts 245 tobe installed, respectively. Moreover, the main body 244 is held up bythe plurality of supporting posts 245 together, such that the main body244 is installed at a height 62 relative to the circuit board 23, inwhich each of the plurality of supporting posts 245 is at least higherthan the highest one of the electronic components 231. Moreover, each ofthe plurality of supporting posts 245 and the main body 244 are twomembers, which may be separated from each other. Furthermore, theheat-dissipating fan 24 of this embodiment is not provided with abarrier wall, which is provided around the fan blade set 243; that is tosay, the heat-dissipating fan 24 is not provided with a flow-limitingchannel, which is delimited by an outer frame and in which the fan bladeset 243 is suspended.

In one embodiment, referring to FIG. 7 and FIG. 8, for the enhancementof stability of the heat-dissipating fan 24 during rotation, thepositions where the plurality of supporting posts 245 are located on thecircuit board 23 may be mapped out, such that a polygon 63 is formed bylines interconnecting positions where the plurality of supporting posts245 are located on the circuit board 23. Nevertheless, the amount of thesupporting post 245 used in the embodiment may be, for example but notlimited to, three. Other appropriate amount of the supporting post 245is also applicable in the present invention. Furthermore, a fixingcomponent 30 is further implemented with each of the plurality ofsupporting posts 245, and fixing each of the plurality of supportingposts 245 on the circuit board 23, wherein the fixing component 30 maybe a nut, a screw, and so on. In addition, referring to FIG. 9, thesupporting frame 241 in one embodiment may be provided with a pluralityof connecting ribs 249, each of the plurality of connecting ribs 249being provided between two adjacent of the plurality of supporting posts245, respectively. The plurality of connecting ribs 249 may be providedfor enhancing the structural strength of the plurality of supportingposts 245. The pattern of the plurality of connecting ribs 249 may bemodified as required for implementation.

Additionally, the top cover 22 is provided thereon with at least onevent 221 facing the heat-dissipating fan 24. In one embodiment, the topcover 22 is provided thereon with the vents 221, and the vents 221 maybe laid out and then formed in accordance with a designed pattern. Inaddition, it is also possible to modify the opening area of the vent 221provided on the top cover 22 as required for implementation, such thatthe vent 221 may be provided for a decorative baffle 26 to be installedtherein. The decorative baffle 26 may be provided with a plurality ofair-permeable holes 261, which are cuttingly provided in accordance witha designed pattern, just as illustrated in FIG. 10. In this embodiment,moreover, the power supply 20 is provided for a user with a choice amonga variety of the decorative baffles 26 on the basis of personalpreference.

1. A power supply, comprising: a bottom case and a top cover, said bottom case and said top cover being fitted together to delimit an accommodating space; a circuit board, mounted on said bottom case and located within said accommodating space, said circuit board being provided thereon with a plurality of electronic components and a plurality of heat-dissipating elements, each of said plurality of heat-dissipating elements being provided correspondingly to one of said plurality of electronic components and allowed to conduct heat, respectively, each of said plurality of heat-dissipating elements being provided with a mounting hole; and a heat-dissipating fan, including a supporting frame, a driving module provided on said supporting frame, and a fan blade set covering said driving module and being driven by said driving module to rotate, said supporting frame being presented as a flat plate and provided with a plurality of connecting ribs, each of the plurality of connecting ribs being respectively connected to one of said mounting holes, said heat-dissipating fan being not provided with a barrier wall around said fan blade set.
 2. The power supply according to claim 1, wherein said mounting hole is replaced by a gap formed between a plurality of fins on said plurality of heat-dissipating elements.
 3. The power supply according to claim 1, wherein lines interconnecting positions where said mounting holes are located are formed as a polygon.
 4. The power supply according to any one of claim 3, wherein said plurality of heat-dissipating elements are of equal height, in such a way that top edges of said plurality of heat-dissipating elements are located on overlapping parallel lines, and each of said mounting holes is respectively located on said top edge of each of said plurality of heat-dissipating elements.
 5. The power supply according to claim 1, wherein said top cover is provided with at least one vent facing said heat-dissipating fan. 6-10. (canceled) 